Automated
Dispense And Die
Attach Systems.
Accommodates any single or double-sided
multi-layer board with through
hole
components or surface mounted
components.
Minimum Die Size: .010" x .010" x .008"
thick. (.25mm x .25mm x .20mm)
Waffle packs from 1" up to 4" Sq.
3" to 6" Wafers.
Solder printing and dispensing of
62/36/2 and 96/4 pastes.
(Custom alloys upon request)
Surface mount capability as small as
0201: 20 mil pitch QFP and CSP
Automated Convection Reflow Ovens
Softbeam Selective Soldering
Active Trim
High Speed Die Attach
Gold Wire Bonding
Encapsulation
Aqueous Wash
Seam Sealing And Resistance Welding
Of Hermetic Packages
